中文版
|
English
About PMR
Technology
Products
Quality
Careers
Press Center
Company introduction
Vision & Mission
Milestones
Contact us
PI metallization technology
Ultra-Thin Copper Clad Laminates
Pre-drilled technology
Features and applications
Technology roadmap
POMILUCK introduction
N series
P series
C series
Customized services
International certificates
Quality guarantee
Technical service
Quality system
Environment policy
Training& education
Career development
Employee welfare
Join PMR
Social activities
About PMR
Company introduction
Vision & Mission
Milestones
Contact us
Company introduction
A-
A+
A Polyimide Metallization Company
Pomiran metalization research Co., Ltd. ( PMR) was established in 2012. It was co-funded by Taiwan Taimide Technology Ltd. and Japan Arakawa Chemical Industries, Ltd. PMR’s core technology is PI Metallization,which is a copper clad laminate system metalized by unique wet chemical treatments and electroplating on the PI film. This technology results in a PI laminate, thin Cu film structure with excellent dimensional stability, metal adhesion and superior ion migration suppression. It is therefore highly suitable for high-end, high density IC package circuit boards
PMR is able to provide copper film thickness under 8um (0.5um achieved) enabling “Green Technology” processes reducing environment impact risks and waste water management cost as a model of next generation manufacturing.