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Products

POMILUCK introduction

The ultra-thin copper clad laminate materials produced by PMR’s Metallization Technology are under the trade name of POMILUCK®

 
Three categories of products are available respectively in order to meet the different application requirements from the markets:

POMILUCK® N-type products which are for ultra fine line circuit boards
POMILUCK® P-type products for ordinary circuit boards
POMILUCK® C-type products for transparent applications

Low Coefficient of Thermal Expansion (CTE) products to be rolled out sequentially.
The PI metallization manufacturing processes of PMR is a roll-to-roll production, and the samples and products are provided to customers in rolled or panel configurations.


Product Usages：
As a metal circuitry laminate for Flexible Printed Circuit (FPCs) used in electronic devices

 

Product Features：
1. Excellent thickness uniformity
2. Superior adhesion characteristics
3. Excellent dimensional stability

 

Model description

 
General FCCL model types : X(a)(b)(c)
X represents the PI film model number
(a) represents the thickness of PI film, between 12 and 50 (μm).
(b) represents single or double-sided metallization, 1 for single-sided, and 2 for double-sided.
(c) represents the thickness of the copper layer, the value will be between 0.2 and 8 (μm).

 

 

Company Taimide PMR
Products PI film Ultra-thin FCCLs
Model TAN High adhesion POMILUCK® N
TP High optical contrast POMILUCK® P
OT olorless and transparent POMILUCK® C