Pomiran^® Polyimide(PI) Film is an innovative product co-developed by Taimide Technology Ltd. and Arakawa Chemical Industries, Ltd. A unique Silane-Infused Technology integrated into the PI polymerization produce Nano size inorganic structures bonded with the functional groups of the PI film.

Nano Anchoring Technology 

The Silane-Infused Pomiran^® films have excellent dimensional stability, high adhesion to metals and particularly suppress ion migration between the circuit traces. Pomiran^® films are capable of makingnanopores on its surfaces after an easy and quick surface treatment. The nanopores create a favorable anchoring condition for chemical electro-less plating and electrolytic plating processes. The metal adhesion can be up to 1 kgf / cm, with either subtractive or semi-additive approaches of circuit fabrication processes

Nano Anchoring and Wet Plating technologies can perform metallization directly on the PI surfaces to form either single sided or double sided copper layers of any thickness. (Conventional FCCL requires micron-scaled roughness to strengthen the adhesion)

Excellence bonding performance after long time thermal aging

PI metallized by Nano Anchoring method provides favorable coupling condition with metals without high alkaline treatment of PI film surfaces improving material dimension stability as well as the bonding strength between metal and PI laminate.