Pomiran^® PI films can be UV laser pre-drilled (25um dia via) before Cu film deposit reducing fabricator process cost while increasing laser via and Cu plating capacity.

Conventional Type

Pre-drilled Type

As the metal layers are plated on PI surface and via hole at a time simultaneously, the copper thicknesses among top and bottom of PI and the wall of via holes are almost same and identical. There is no through hole reliability issue which easily failed in conventional FPC. Particularly the small-diameter hole-filling process is pretty simple. The production yields are higher than that of the ordinary blind vias, and the reliability performance of the Pre-drilled Technology is extremely well.

Advantages of Pre-drilled technology：

1. Pre-drilled technology can simplify the FPC manufacturing process, thus significantly increasing circuit board production efficiency, capacity and reducing production costs.
2. The PMR metal deposition process insures copper layer thickness uniformity between the surface and the via hole side walls insuring high reliability structures.
3. Customized copper thickness (0.5um to 8.0um) eliminates copper thinning process and improved copper thickness variations.
4. Elimination of shadow and through via plating processes.
5. Improved micro-via yield rates.
6. Pre-drilled filled copper via structure option eliminates blind via desmear process.

　　　　　　　　　　　　PMR Pre-drilled FCCL　　　　　　　　　　　　　　　　　Subtractive or MSAP Type FPC