Ultra Thin Flexible Copper Clad Laminate (Ultra Thin FCCL)

Direct metallization on Pomiran^® PI as an Ultra Thin FCCL is realized by chemical electro-less plating metal seed layer and electrolytic plating copper layer on the PI film surface. Single-sided and double-sided flexible copper clad laminate materials are available for flexible circuit board application.

Advantages of the products：
1. The reel to reel production utilizes very low tension processing, thus material shrinkage stability is excellent.
2. Copper thickness can be customized based customer specifications (0.2μm ~ 8μm).
3. Pomiran® metallized PI materials have superior thermal resistance and reliability compared to conventional TPI lamination type FCCL.
4. The interface between PI and metal is of ultra-low roughness which facilitates better etching efficiency and etching factor for making fine line circuit boards. 5. It is applicable for both the subtractive process and semi-additive process.

Product applications：
Applicable for ordinary flexible circuit boards up to high-end package carriers.

　　　　　　　　　　　PMR Ultra Thin FCCL　　　　　　　　　　　　　　　　　　　　FPC Subtractive Processes