The demand for lighter, thinner, more compact high-density future electronic product developments are well suited for Pomiran^® PI Nano-Anchoring Metallization and Pre-drilled Technologies.

Applicable for ordinary flexible circuit boards up to high-end package carriers

Three categories of products have been rolled out respectively in order to meet the different application requirements from the markets, the POMILUCK^® N-type products which are for applying to the ultrafine line circuit boards, the POMILUCK^® P-type products which are for ordinary circuit boards, and the POMILUCK^® C-type products which are suitable for see-through requirement, etc., and there comes low Coefficient of Thermal Expansion (CTE) products to be rolled out sequentially. We will provide customers a wide product diversification. The PI metallization manufacturing processes of PMR are entirely of roll-to-roll production, and the samples and products are provided to customers in rolled type.